- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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25 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
35,000
In-stock
|
Buy Now Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
35,000
In-stock
|
Buy Now Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
35,000
In-stock
|
Buy Now Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
35,000
In-stock
|
Buy Now Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU W/AD... |
35,000
In-stock
|
Buy Now Get Quote |