6-1437529-6

Mfr.Part #
6-1437529-6
Manufacturer
TE Connectivity AMP Connectors
Package/Case
-
Datasheet
Download
Description
CONN IC DIP SOCKET 6POS GOLD
Stock
35000

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Manufacturer :
TE Connectivity AMP Connectors
Product Category :
IC Sockets
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
20.0µin (0.51µm)
Contact Finish Thickness - Post :
47.2µin (1.20µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Copper Alloy
Features :
Closed Frame
Housing Material :
Thermoplastic, Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
6 (2 x 3)
Operating Temperature :
-55°C ~ 105°C
Product Status :
Obsolete
Termination :
Solder
Datasheets
6-1437529-6

Extensive range of product categories and brands.

Hundreds of thousands of SKUs available. Covers various types of electronic components such as ICs, sensors, resistors, capacitors, etc. Fast delivery:

Same-day or within 24-hour shipping commitment.

Quick processing and dispatch for most orders. High on-time delivery rate to meet customer demands promptly. Competitive pricing:

Ensuring competitive prices through market research and analysis.

Quantity discounts and special pricing options. Price matching policy to guarantee customers the best prices. Customer and technical support:

Round-the-clock customer support service.

Multiple contact channels like phone, email, and live chat. Fast response time with replies typically within hours. Dedicated technical support team to address customer queries and provide design advice. Logistics and supply chain services:

Established global logistics network for comprehensive support.

Flexible logistics solutions, including express, air, and sea freight. Strong partnerships with reliable suppliers for a stable supply chain. Design support:

Offer design support and engineering solutions.

Collaborate with customers to provide customized design assistance and consulting services. Provide engineer training and access to technical resources.

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