HSB22-606010

Mfr.Part #
HSB22-606010
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, BGA, 60 X 60 X 10 MM
Stock
35000

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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
9.8W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
2.60°C/W @ 200 LFM
Thermal Resistance @ Natural :
7.62°C/W
Type :
Top Mount
Datasheets
HSB22-606010

Extensive range of product categories and brands.

Hundreds of thousands of SKUs available. Covers various types of electronic components such as ICs, sensors, resistors, capacitors, etc. Fast delivery:

Same-day or within 24-hour shipping commitment.

Quick processing and dispatch for most orders. High on-time delivery rate to meet customer demands promptly. Competitive pricing:

Ensuring competitive prices through market research and analysis.

Quantity discounts and special pricing options. Price matching policy to guarantee customers the best prices. Customer and technical support:

Round-the-clock customer support service.

Multiple contact channels like phone, email, and live chat. Fast response time with replies typically within hours. Dedicated technical support team to address customer queries and provide design advice. Logistics and supply chain services:

Established global logistics network for comprehensive support.

Flexible logistics solutions, including express, air, and sea freight. Strong partnerships with reliable suppliers for a stable supply chain. Design support:

Offer design support and engineering solutions.

Collaborate with customers to provide customized design assistance and consulting services. Provide engineer training and access to technical resources.

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