XCVM1302-2MSEVSVD1760

Mfr.Part #
XCVM1302-2MSEVSVD1760
Manufacturer
AMD Xilinx
Package/Case
-
Datasheet
Download
Description
IC VERSALPRIME ACAP FPGA 1760BGA
Stock
35000

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Architecture :
MPU, FPGA
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size :
-
Operating Temperature :
0°C ~ 100°C (TJ)
Package / Case :
1760-BFBGA, FCBGA
Peripherals :
DDR, DMA, PCIe
Primary Attributes :
Versal™ Prime FPGA, 70k Logic Cells
Product Status :
Active
RAM Size :
-
Speed :
600MHz, 1.4GHz
Supplier Device Package :
1760-FCBGA (40x40)

Extensive range of product categories and brands.

Hundreds of thousands of SKUs available. Covers various types of electronic components such as ICs, sensors, resistors, capacitors, etc. Fast delivery:

Same-day or within 24-hour shipping commitment.

Quick processing and dispatch for most orders. High on-time delivery rate to meet customer demands promptly. Competitive pricing:

Ensuring competitive prices through market research and analysis.

Quantity discounts and special pricing options. Price matching policy to guarantee customers the best prices. Customer and technical support:

Round-the-clock customer support service.

Multiple contact channels like phone, email, and live chat. Fast response time with replies typically within hours. Dedicated technical support team to address customer queries and provide design advice. Logistics and supply chain services:

Established global logistics network for comprehensive support.

Flexible logistics solutions, including express, air, and sea freight. Strong partnerships with reliable suppliers for a stable supply chain. Design support:

Offer design support and engineering solutions.

Collaborate with customers to provide customized design assistance and consulting services. Provide engineer training and access to technical resources.

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